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Ultrasonic Cleaning Unit Product List

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Cleaning Unit "Fine Jet" for the Chemical Field

A cleaning unit that promotes chemical reactions from low power to high power.

In the field of chemistry, there is always a demand for improving the efficiency and accuracy of reactions. In particular, the cleaning of reaction vessels and substrates is crucial for the removal of impurities that can hinder reactions. If proper cleaning is not performed, it can lead to delays in reactions or incomplete combustion, ultimately negatively affecting the quality of the final product. Our cleaning unit, "Fine Jet," provides stable oscillation from low to high output, contributing to the efficiency of chemical reaction processes. [Usage Scenarios] - Cleaning of reaction vessels - Cleaning of substrates - Pre-cleaning before reagent preparation [Effects of Implementation] - Improved reaction efficiency - Stabilization of product quality - Reduction of cleaning time

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  • Ultrasonic Cleaning Unit

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Cleaning Unit "Fine Jet" for Metal Processing

From low power to high power, we meet the needs for deburring and cleaning in metal processing!

In the metal processing industry, the removal of burrs after machining is crucial for ensuring quality and safety. Especially in the case of precision parts and complex-shaped metal products, complete removal of burrs is required. If burrs remain, they can lead to product malfunctions and safety issues. The cleaning unit "Fine Jet" meets a wide range of needs for burr removal cleaning in metal processing through stable oscillation from low to high output. 【Usage Scenarios】 * Cleaning after burr removal of metal parts * Cleaning of precision machine parts * Cleaning of parts after cutting processing 【Benefits of Implementation】 * Improvement in product quality through reliable burr removal * Reduction and efficiency of cleaning time * Compatibility with various metal materials

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Proximity Megasonic for Photomasks PA10-Q60AE-S

A cleaning unit that achieves submicron level particle removal.

In the photomask industry, the removal of fine particles during the manufacturing process is a critical challenge that affects product quality and yield. In particular, the cleaning of wafers and photomasks requires the removal of submicron-level contaminants. Inadequate cleaning can lead to decreased device performance and the occurrence of defective products. Our cleaning unit, the "Proximity Megasonic PA10-Q60AE-S," enables cleaning close to the substrate and addresses these challenges by removing submicron particles. [Usage Scenarios] - Cleaning of silicon wafers - Cleaning of photomasks - Cleaning after CMP - Batch cleaning [Benefits of Implementation] - Improved yield due to high cleaning performance - Enhanced product quality - Reduced cleaning time

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  • Ultrasonic Cleaner
  • Ultrasonic Cleaning Unit

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Cleaning unit for semiconductors "Fine Jet"

From low power to high power, we meet the precision cleaning needs of semiconductor manufacturing!

Precision cleaning in the semiconductor industry is a crucial process that affects product quality and yield. Particularly as miniaturization advances, fine foreign substances and residues adhering to wafers and substrates can lead to decreased device performance and defects. Therefore, high cleaning capability and minimizing damage to substrates are required. Fine jets contribute to solving challenges in semiconductor manufacturing by providing stable oscillation from low to high output, addressing various cleaning needs. 【Usage Scenarios】 - Wafer substrate cleaning - Magnetic disk cleaning - Post-CMP wafer cleaning 【Benefits of Implementation】 - Response to a wide range of cleaning needs - Improved yield through high-quality cleaning - Optimal cleaning through diverse nozzle variations

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  • Ultrasonic Cleaning Unit

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Cleaning Unit "Fine Jet" for Electronic Devices

From low power to high power, we meet a wide range of needs for electronic device circuit board cleaning!

In the electronics industry, substrate cleaning is an important process for ensuring product quality and reliability. Especially in the case of miniaturized electronic components, thorough removal of foreign substances and residues is required. Inadequate cleaning can lead to decreased product performance or failure. Our cleaning unit, "Fine Jet," responds to a wide range of needs for electronic device substrate cleaning with stable oscillation from low to high output. 【Usage Scenarios】 - Cleaning of various wafer substrates - Cleaning of magnetic disks - Wafer cleaning after CMP 【Benefits of Implementation】 - Compatibility with diverse substrates - Improvement in product quality - Yield enhancement

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  • Ultrasonic Cleaning Unit

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Cleaning unit "Fine Jet" for glass surface treatment.

From low power to high power, we meet a wide range of needs for glass surface treatment!

In the glass surface treatment industry, thorough cleaning of the substrate is essential to achieve high-quality surface treatment. In particular, if foreign substances or oil residues remain, it can significantly impair the quality of subsequent coatings or processing. Inconsistent cleaning or insufficient cleaning power can lead to product defects and reduced yield. FineJet allows for the selection of various frequencies, enabling the setting of optimal cleaning conditions for the characteristics of glass substrates and the surface treatment process. 【Usage Scenarios】 - Post-CMP cleaning of glass substrates - Cleaning of various glass substrates - Pre-treatment before surface processing 【Benefits of Implementation】 - Improved cleaning quality - Enhanced yield - Increased efficiency of the surface treatment process

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  • Ultrasonic Cleaning Unit

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